Products
Normal type Pitch 1.0mm side entry type Wire to Board Connector for automotive electronics
We supply Wafer connector/ Wire to Board connector with different pitch and media type for customers all over the world .
Products are widely used on computer and peripheral products, digital electronic products, communication electronic products, automobile electronic products, banking terminal electronic products, medical electronic products and home appliances electronic products, etc.
We strictly in accordance with the ISO9001/ISOI14001 quality management system standards for quality control. we are expecting become your long-term partner in china.
Product Specification:
| Insulator | Thermoplastic High temperature resistance UL94V-0 |
| Contact Material | Copper Alloy Tin/Gold plated over nickle plated |
| Operating Voltage | 200V AC |
| Current rating | 0.5A |
| Operating Temperature | -25–+85 degree |
| Insulation resistance | ≧100MΩ |
| Application | computers,digital camera; card reader |
| Standard packing quantity | 1500pcs |
| MOQ | 1500pcs |
| Lead time | 2 weeks |
Company advantages:
● We are manufacturer ,with about 20 years experiences in electronic connector field , there are about 500 staff in our factory now.
● From designing of the products,–tooling– Injection – Punching – Plating – Assembly – QC Inspection-Packing – Shipment, we finished all the process in our factory except plating .So we can well control the quality of the goods.We can also customized some special products for customers.
● Fast respond. From sales person to QC and R&D engineer ,if customers have any problems, we can reply customer at first time.
● Variety of products: Card connectors/FPC Connectors/Usb connectors/ wire to board connectors /board to board connectors /hdmi connectors/rf connectors /battery connectors …
Packing details: Products are packed with reel & tape packing ,with vacuum packing ,outer packing is in cartons .
Shipping Details: We choose DHL/ UPS/FEDEX/TNT international shipping companies to ship the goods .
